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The newest addition to the Kizen product line, Kizen HEAT serves as the perfect complement to Kizen FORCE and Kizen ICE. Ideal for hot fill applications, Bostik’s latest next generation hot melt adhesive for case and carton sealing possesses a high heat resistance and the ability to withstand high temperature shipping conditions.

Formulated with proprietary water-white technology, Kizen HEAT has passed the IOPP Method T-3006 Heat Resistance Under Stress test and has been approved for use in applications of at least 160°F (71°C) for 24 hours.

In addition to offering superior bonds in high temperature environments, Kizen HEAT enables increased plant productivity, reduced adhesive use and improved packaging performance overall.

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